8’’, 12’’ wafer test, & multi-die and single die test
Edge coupling, grating coupling, free space coupling
100% automatic
OO/OE/EO/EE, active/passive test, DC/RF test
Modular design enables high flexibility & scalability
Very high accuracy and efficiency
Open architecture software
AI data analysis enables test simplification & yield prediction
Multiple options available: Turnkey solution; Packaging & test all-in-one solution; Test-only solution
Additional services: Test OEM service; Testability design consultant service; Abundant metrological IP
